SAE Default Manufacturing Specifications

Scope: When manufacturing specifications are not provided by the customer, we will use this specification.

Note: All PCBs will be built and inspected to the following IPC Standards: IPC-A-600 Class II Acceptability of Printed Boards IPC-6012A Class II Qualification & Performance for Rigid Printed Boards

  1. GENERAL:
    Order of precedence
  2. Any notes on the Purchase Order
  3. Customer provided drawing
  4. Customer supplied specification
  5. This specification
  • There shall be no functional deviation from customer data without customer approval.
  • All standard Printed Circuit Boards will be manufactured with UL approved materials and processes. (There can be exceptions for experimental and/or exotic materials not covered under UL.)
  • Each board is to be marked with the vendor logo, UL designator and date code with the date code displayed in the following format: (WWYY).

1 st choice: Top silkscreen

2nd choice: Bottom Silkscreen

1 st choice with no legend film: Etch

Default stack up is 1/2 oz Inner Layer Signals, 1 oz Inner Layer Planes, and ½ oz outerlayer copper for a balanced foil construction.

If spacing is less than .006 on Inner Layer Planes, ½ oz copper will be used.

Standard Overall Thickness is .062” +/- .006”.

  1. MANUFACTURING DEFAULTS:
    Plating and Final Finish: If not specified, boards will be vertically Hot Air Leveled using 63/37 Tin Lead solder and will be covered and solderable. Soldermask will be over bare copper.
    Final Finish standard thickneses: • Immersion Gold: 2-4 Micro Inches (Selective and SMT) • Hard gold: 30-50 Micro Inches (Tab Plating) • Nickel: 120-200 microinches • Solder: 250+ microinches

Screening and Soldermask: Soldermask will be Green Semi-Gloss Liquid Photoimageable mask over bare copper applied to both sides. Silkscreen will be white, permanent, non-conductive epoxy ink. Minimum line width for silkscreen is .006”. Via plug/fill will be non-conductive epoxy via fill.

Physical Dimensional Tolerances:

Rout:

  • External Board: +/- .010”
  • Internal Features: +/- .005”

Required Spacing for Scoring (from conductor to board edge)

  • on 15° blade = 0.015″ minimum
  • on 30° blade = 0.025″ minimum
SAE Capability Matrix & Technology Roadmap 03-18-16

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