| PCB FEATURE |
CAPABILITY |
| Standard Panel Size |
18"x24" |
| Max Number of Layers |
24 |
| Minimum Power/Ground Plane Separation |
0.005" 1/2 oz Cu, 0.007" 1 oz Cu, 0.010" on 2 oz Cu |
| Minimum Inner Layer Trace - All Cu Weights |
0.003" |
| Minimum Inner Layer Space - 1/2 oz Cu |
0.003" |
| Minimum Inner Layer Space - 1 oz Cu |
0.004" |
| Minimum Inner Layer Space - 2 oz Cu |
0.005" |
| Minimum Outer Layer Trace 1/4 or 3/8 oz CU Foil |
0.003" |
| Minimum Outer Layer Space 1/4 or 3/8 oz CU Foil |
0.003" |
| Minimum Outer Layer Trace 1/2 oz CU Foil |
0.003" |
| Minimum Outer Layer Space 1/2 oz CU Foil |
0.003" |
| Minimum Outer Layer Trace 1 oz CU Foil |
0.004" |
| Minimum Outer Layer Space 1 oz CU Foil |
0.004" |
| Minimum Outer Layer Trace 2 oz CU Foil |
0.005" |
| Minimum Outer Layer Space 2 oz CU Foil |
0.005" |
| Minimum Pad Size Over Drill Size - Inner Layer |
0.010", 0.005" per side |
| Minimum Pad Size Over Drill Size - Outer Layer |
0.008", .004" per side |
| Minimum Plane Clearance over Drill Size |
0.020", 0.010" per side |
| Minimum Core Dielectric Thickness |
0.002" |
| Minimum Prepreg Dielectric Thickness |
0.0023" |
| Smallest Drilled Via Hole |
0.007" |
| Aspect Ratio |
10 to 1 |
| Plated Hole Tolerance |
± .002" |
| Blind / Buried Vias |
Yes |
| Controlled Depth Drilling |
Yes |
| Via Fill |
Non-Conductive & Conductive |
| Min. Solder Mask Clearance |
0.005" overall, 0.0025" side |
| Min. Solder Mask Web Width |
0.003" |
| Min. Surface Mount Pitch |
0.008" |
| Min. Cu Clearance From Edge |
0.010" |
| Min. Board Thickness |
0.008" |
| Max. Board Thickness |
0.140" |
| Cu Thickness Range |
0.25 to 4 oz |
| Routing Dimension Tolerance |
± 0.002" |
| Scoring |
Surface / Jump / Angled / Rounded |
| Scoring Dimension Tolerance |
± 0.002" |
| Scoring Web Thickness Tolerance |
± 0.001" |
| Controlled Impedance (Single-ended & Differential) |
± 10% |
| Best Panel Array Size(s) |
8.25" x 11.25" |
| Printed Resistors - A service offered to our customers that allows
for a >90% BOM savings on resistors and the associated assembly and labor costs
over conventional resistors. |
Peters Peelable Mask - A service offered to our customers which
allows for savings on sequential assembly processes by eliminating the need
for KAPTON tape and the associated labor costs. |
Solid Solder Deposition and Precision Pad Technology - A service
offered to our customers which eliminates an assembler's or OEM's
need for flux and solder, while eliminating >90% of assembly
related defects. |
