M/L Up to 24 Layers

Though we still manufacture double sided board prototypes, our largest product range is in the multilayer arena.

Standard constructions are used on most multilayers, unless a design print has alternate instructions. In most cases, the standard build-up for internal layers which are ground or power planes will be built on 1oz copper, and signal layers are built on 1/2oz copper weight. 1/2oz copper foil is used on outer layers, unless the design demands otherwise.

Our order of precedence primarily relies on your board print and any stack-up information provided at the time of quote. If there are impedance requirements in the design, the order of precedence will revert to the impedance calculations, with your approval if required. If no stack-up information is provided, we will utilize our Default Manufacturing Standard.

The following are our standard stack-ups:

  • 4 Layers: 0.028” core (middle dielectric)
  • 6 Layers: 0.014” core (dielectric)
  • 8 Layers: 0.008” core (dielectric)
  • 10 layers: 0.006” core (dielectric)
  • 12 Layers: 0.005-0.004” core (dielectric)
  • 14+ Layers: 0.003” core (dielectric)
Techwave CIRCUITS COLORADO, Inc. Rev 2/15/13
STANDARD PRODUCTION CAPABILITIES MATRIX
PCB FEATURE STANDARD ADVANCED
Standard Panel Size 18″X24″ (Contact Eng.)
Useable Area on Panel 16.5″ X 22.5″ (Contact Eng.)
Max. Board Thickness 0.010″ 0.003″
Max. Board Thickness 0.225″ 0.228″
Max Number of Layers 16 26
Minimum Circuit Width – (3/8 oz Cu) 0.003″ 0.0025″
Minimum Circuit Width – ((1/2 oz Cu) 0.004″ 0.003″
Minimum Circuit Width – (1 oz Cu) 0.004″ 0.0035″
Minimum Circuit Width – (2 oz Cu) 0.005″ 0.0045″
Minimum Circuit Width – (3 oz Cu) 0.007″ 0.006″
Minimum Spacing Between Circuits – (3/8 oz Cu 0.003″ 0.0025″
Minimum Spacing Between Circuits – (1/2 oz Cu) 0.004″ 0.003″
Minimum Inner Layer Spacing Between Circuits – (1 oz Cu) 0.004″ 0.004″
Minimum Inner Layer Spacing Between Circuits – (3 oz Cu) 0.009″ 0.009″
Minimum Inner Layer Spacing Between Circuits – (2 oz Cu) 0.006″ 0.005″
Minimum Inner Layer Spacing Between Circuits – (3 oz Cu) 0.008″ 0.007″
Minimum Power/Ground Plane Separation – (3/8 oz Cu) 0.004″ 0.004″
Minimum Power/Ground Plane Separation – (1/2 oz Cu) 0.005″ 0.004″
Minimum Power/Ground Plane Separation – (1 oz Cu) 0.006″ 0.005″
Minimum Power/Ground Plane Separation – (2 oz Cu) 0.008″ 0.007″
Minimum Power/Ground Plane Separation – (3 oz Cu) 0.012″ 0.010″
Minimum Pad Size Over Drill Size 0.006″, 0.003″ per side 0.005″, 0.0025″ per side
Minimum Core Dielectric Thickness 0.003″ 0.002″
Smallest Drilled Via Hole 0.0063″ 0.0059″
Preferred via hole tolerance + 0.000″/ -0.0xx” same
Maximum Hole-to-Board Thickness Aspect Ratio 10 to 1 12 to 1
Backdrilling No Yes
Minimum Plated Hole Tolerance ± 0.003″ ± 0.0025″
Min. Solder Mask Clearance 0.004″, 0.002″/side 0.003″, 0.0015″/side
Min. Solder Mask Web Width – All colors 0.004″ 0.003″
Min. Surface Mount BGA Pitch 0.016″ 0.012″
Min. Cu Clearance From Edge 0.005″ 0.003″
Cu Thickness Range H oz to 3 oz 3/8 oz to 4+ oz
Routing Dimension Tolerance ± 0.005″ ±0.003″
Scoring Dimension Tolerance ± 0.005″ ±0.003″
Scoring Web Thickness Tolerance (Thinnest material 0.018″) ± 0.005″ ±0.003″
Controlled Impedance (Single-ended & Differential) ± 10% ± 5%
Blind / Buried Vias Capability YES YES
Controlled Depth and Selective Routing and Drilling ± 0.008″ ± 0.005″
Countersink/Counterbore Capability All sizes ±0.005″
Via Fill YES YES
Castellations and plated Slots YES YES
TMM Ceramic, Teflon, and Aluminum Substrates YES YES
Fusion Bonding of Teflon Substrates YES YES
Electrical Testing 100% & Hi-Pot to 3000V (Contact Eng.)

We Promise to give you quality

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