M/L Up to 24 Layers

Multilayer PCB productionThough we still manufacture double sided board prototypes, our largest product range is in the multilayer arena.

Standard constructions are used on most multilayers, unless a design print has alternate instructions. In most cases, the standard build-up for internal layers which are ground or power planes will be built on 1oz copper, and signal layers are built on 1/2oz copper weight. 1/2oz copper foil is used on outer layers, unless the design demands otherwise.

Our order of precedence primarily relies on your board print and any stack-up information provided at the time of quote. If there are impedance requirements in the design, the order of precedence will revert to the impedance calculations, with your approval if required. If no stack-up information is provided, we will utilize our Default Manufacturing Standard.

 The following are our standard stack-ups:

  • 4 Layers: 0.028” core (middle dielectric)
  • 6 Layers: 0.014” core (dielectric)
  • 8 Layers: 0.008” core (dielectric)
  • 10 layers: 0.006” core (dielectric)
  • 12 Layers: 0.005-0.004” core (dielectric)
  • 14+ Layers: 0.003” core (dielectric)

SAE CIRCUITS COLORADO, Inc.

Rev 2/15/13

STANDARD PRODUCTION CAPABILITIES MATRIX

PCB FEATURE

CAPABILITY

Standard Panel Size

18″ X 24″ (16″ X 22″ usable)

Min. Board Thickness

0.008″

Max. Board Thickness

0.225″

Max Number of Layers

18

Minimum Inner Layer Circuit Width Grouped Circuits – (3/8 oz Cu)

0.003″

Minimum Inner Layer Circuit Width Grouped Circuits – ((1/2 oz Cu)

0.004″

Minimum Inner Layer Circuit Width Grouped Circuits – (1 oz Cu)

0.004″

Minimum Inner Layer Circuit Width Grouped Circuits – (2 oz Cu)

0.006″

Minimum Inner Layer Circuit Width Grouped Circuits – (3 oz Cu)

0.007″

Minimum Inner Layer Spacing Between Circuits – (3/8 oz Cu)

0.003″

Minimum Inner Layer Spacing Between Circuits – (1/2 oz Cu)

0.0045″

Minimum Inner Layer Spacing Between Circuits – (1 oz Cu)

0.005″

Minimum Inner Layer Spacing Between Circuits – (2 oz Cu)

0.008″

Minimum Inner Layer Spacing Between Circuits – (3 oz Cu)

0.009″

Minimum Inner Layer Circuit Width for an Isolated Circuit (3/8 oz Cu)

0.0035″

Minimum Inner Layer Circuit Width for an Isolated Circuit (1/2oz Cu)

0.0045″

Minimum Inner Layer Circuit Width for an Isolated Circuit (1 oz Cu)

0.005″

Minimum Inner Layer Circuit Width for an Isolated Circuit (2 oz Cu)

0.008″

Minimum Inner Layer Circuit Width for an Isolated Circuit (3 oz Cu)

0.010″

Minimum Inner Layer Power/Ground Plane Separation – (3/8 oz Cu)

0.004″

Minimum Inner Layer Power/Ground Plane Separation – (1/2 oz Cu)

0.005″

Minimum Inner Layer Power/Ground Plane Separation – (1 oz Cu)

0.007″

Minimum Inner Layer Power/Ground Plane Separation – (2 oz Cu)

0.009″

Minimum Inner Layer Power/Ground Plane Separation – (3 oz Cu)

0.013″

Minimum Outer Layer Circuit Width Grouped Circuits – (3/8 oz Cu)

0.003″

Minimum Outer Layer Circuit Width Grouped Circuits – (1/2 oz Cu)

0.004″

Minimum Outer Layer Circuit Width Grouped Circuits – (1 oz Cu)

0.005″

Minimum Outer Layer Circuit Width Grouped Circuits – (2 oz Cu)

0.007″

Minimum Outer Layer Circuit Width Grouped Circuits – (3 oz Cu)

0.008″

Minimum Outer Layer Spacing Between Circuits – (3/8 oz Cu)

0.0035″

Minimum Outer Layer Spacing Between Circuits – (1/2 oz Cu)

0.005″

Minimum Outer Layer Spacing Between Circuits – (1 oz Cu)

0.006″

Minimum Outer Layer Spacing Between Circuits – (2 oz Cu)

0.009″

Minimum Outer Layer Spacing Between Circuits – (3 oz Cu)

0.010″

Minimum Outer Layer Circuit Width for an Isolated Circuit (3/8 oz Cu)

0.004″

Minimum Outer Layer Circuit Width for an Isolated Circuit (1/2oz Cu)

0.005″

Minimum Outer Layer Circuit Width for an Isolated Circuit (1 oz Cu)

0.007″

Minimum Outer Layer Circuit Width for an Isolated Circuit (2 oz Cu)

0.009″

Minimum Outer Layer Circuit Width for an Isolated Circuit (3 oz Cu)

0.012″

Minimum Outer Layer Power/Ground Plane Separation – (3/8 oz Cu)

0.005″

Minimum Outer Layer Power/Ground Plane Separation – (1/2 oz Cu)

0.006″

Minimum Outer Layer Power/Ground Plane Separation – (1 oz Cu)

0.008″

Minimum Outer Layer Power/Ground Plane Separation – (2 oz Cu)

0.010″

Minimum Outer Layer Power/Ground Plane Separation – (3 oz Cu)

0.014″

Minimum Clearance or Pad Size Over Drill Size – Inner Layer

0.010″, 0.005″ per side

Minimum Clearance or Pad Size Over Drill Size – Outer Layer

0.008″, 0.004″ per side

Minimum Plane Clearance over Drill Size – Outer Layer

0.020″, 0.010″ per side

Minimum Core Dielectric Thickness 

0.002″

Minimum Prepreg Dielectric Thickness

0.0023″

Smallest Drilled Via Hole

0.007″

Smallest Plated Microvia

0.005″

Preferred via hole tolerance

+ 0.000″/ -0.012″ (or equivalent)

Maximum Hole-to-Board Thickness Aspect Ratio

10 to 1

Minimum Plated Hole Tolerance

± .003″

Min. Solder Mask Clearance

0.005″ overall, 0.0025″ side

Min. Solder Mask Web Width

0.003″

Min. Surface Mount  Pitch

0.008″

Min. Cu Clearance From Edge

0.010″

Cu Thickness Range

0.25 oz to 4 oz

Routing Dimension Tolerance

± 0.005″

Scoring

Surface / Jump Scoring

Scoring Dimension Tolerance

± 0.005″

Scoring Web Thickness Tolerance (Thinnest material 0.018″)

± 0.003″

Controlled Impedance (Single-ended & Differential)

±10%

Best Panel Array Size(s)

8.25″ x 11.25″

Blind / Buried Vias Capability

Yes

Controlled Depth and Selective Routing and Drilling

Yes

Countersink Capability

All sizes, ±0.005″

Via Fill / Via Plug

Non-Conductive & Conductive

Castellations

Yes, Plated

Plated Slots

Yes

Ceramic, Teflon, and Aluminum Substrates

Yes

Fusion Bonding of Teflon Substrates

Yes

Electrical Testing

100% Independent Testing by Gardien Electrical Testing Services

For more information on our products and services, contact us or request a quote.