The challenges in today’s RF environment are threefold and are dependent on material properties, tight tolerancing, and repeatability. Material properties include Dielectric Constant (Dk), Dissipation Factor (Df), stability in the x/y and Z axes, and a Very Low Profile on the conductor surface.
We currently build RF antennas using all available and experimental materials. We generally build using materials from Arlon, Rogers , Taconic , and Isola . We can attempt to acquire any material needed, or use Customer Supplied Materials if necessary.
Bonding of multilayer antennas is another of our specialties. We utilize 4450B Bond-ply for most Duroid applications. In cases where little or no flow is a must, we utilize bond-plies such as Rogers 3001 and Dupont FRP and Tedlar PVF .
Teflon multilayers require robust bond-plies such as the Rogers 3001 and Dupont FRP or Tedlar PVF or, depending on the material and Teflon % content, they can be bonded using a Teflon Fusing process at high temperatures. In the Teflon Fusing process there are no added bond-plies or pre-preg layers.
Plating on Teflon Substrates requires special preparation, and we utilize an outside service for this. As a result, when plating on Teflon is required, we are currently at our standard 10-day turn service.